Packaging designs continue to evolve and thermal management must evolve with it.  MC-21's rolled and stamped MMC's provide the best value in Flip Chip lids and stiffeners.  With low CTE and good thermal conductivity, MC-21's MMC30 material is a much more cost-effective solution than other traditional Al-SiC suppliers. 

MC-21's Al-SiC MMC can be cast into complex designs which could eliminate a Thermal Interface Material (TIM) layer.  Our MMC30 with a CTE of 14.5 ppm/C or MMC45 with a CTE of 10.5 ppm/C can integrate the cavity/pedestal features of a thermal spreader with the fins of a heat sink to eliminate the TIM 2 layer in microelectronic packaging, reducing thermal resistance and improving overall production costs, time and handling.

Table of Properties

	MMC 30	MMC 45	Aluminum	Copper	Other Al-SiC	CuMo	CuW
SiC (vol %)	30	45	0	0	63	0	0
Products	Sheet/Cast	Cast	Sheet/Cast	Sheet	Preform	Sheet	Sheet
Density (g/cc)	2.80	2.90	2.70	8.90	3.10	9.66	16.3
CTE (ppm) 25-150 C	14.5	10.5	22.5	17.5	8.5	10.3	7.0
Thermal Conductivity (W/mK)	175	180	170	390	190	230	195
Specific Modulus (Stiffness)	40	60	27	15	60	tbd	tbd
Relative Price	$	$	¼$	$	$$$	$$$	$$$
values listed in this table are typical values for comparison purposes only