Al-SiC for use as metal substrate within Printed Circuit Board Assemblies or as base substrate in Printed Electronics
MC-21 MMC30 panels can
Reduce the Coefficient of Thermal Expansion: aluminum alloys' CTE can range from 22 to 25 ppm/C. Copper is typically 17.5 ppm/C. MC-21's MMC 30 is low at 14 ppm/C, 45% better than Al and 20% better than Cu.
Leverage the high Stiffness characteristics to:
Reduce the thickness of the metal without sacrificing rigidity
Increase the printed copper thickness without warping
Improve solder joint reliability with its low CTE as well as its high damping (low vibration) characteristics
Table of Properties
MMC 30
Aluminum
Copper
SiC (vol %)
30
0
0
Products
Sheet/Cast
Sheet/Cast
Sheet
Density (g/cc)
2.80
2.70
8.90
CTE (ppm) 25-150 C
14.5
22.5
17.5
Thermal Conductivity (W/mK)
175
170
390
Specific Modulus (Stiffness)
40
27
15
Relative Price
$
¼$
$
values listed in this table are typical values for comparison purposes only
Contact MC-21 for pricing on panels ranging in thickness from 0.5mm to > 5.0 mm.
